Jau-Shiung Fang, Chin-Fu Chiu, Jia-Huei Lin, Ting-Yi Lin, and Tsung-Shune Chin (2009) “Failure Mechanism of 5 nm Thick Ta-Si-C Barrier Layers Against Cu Penetration at 750-800°C” J. ElectroChem. Soc. 156(2) H147-H152. (SCI).
2
C.S. Hsu, H.Y. Hsieh, and J.S. Fang (2008) “Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films”J. Electro. Mater. 37 (6) 852-859. (SCI).
3
Ting-Yi Lin, Huai-Yu Cheng, Tsung-Shune Chin, Chin-Fu Chiu and Jau-Shiung Fang(2008) “Highly Thermal-Stable Amorphous TaSi2Cx Films as Diffusion Barrier” J. ElectroChem. Soc. 155(2) G29-G32. (SCI).
4
J.S. Fang, T.P. Hsu, M.L. Ker, H.C. Chen, J.H. Lee, C.S. Hsu, and L.C. Yang, (2008) “Evaluation of properties of Ta-Ni amorphous thin film for copper metallization in integrated circuits” J. Phys. Chem. Solids, 69, 430 – 434. (SCI).
5
T.Y. Lin, H.Y. Cheng, T.S. Chin, C.F. Chiu, and J.S. Fang (2007) “5-nm-thick TaSiC amorphous films stable up to 750oC as a diffusion-barrier for copper metallization” Appl. Phys. Lett. 91, 152908(SCI).
6
J.S. Fang, M.L. Ker and H.C. Chen, (2007)”Evaluation of dc-sputtered Glassy Ta-Co-N Thin Film for Copper Metallization” J. Electro. Mater.,36 (11) 1462-1468. (SCI).
7
J.S. Fang, T.P. Hsu, and H.C. Chen, (2007)” Barrier Properties of Amorphous Binary Ta-Ni Thin Films for Cu Interconnection” J. Electro. Mater. 36 (5) 614-622(SCI).
8
J.S. Fang and H.Y. Hsieh, (2007)” Structural and passivative behaviors of Cu(In) thin film” J. Electro. Mater. 36 (2) 129-135 (SCI).
9
J.K. Hsiao, M.F. Tai, Y.C. Lee, C.Y. Yang, H.Y. Wang, H.M. Liu, J.S. Fang, and S.T. Chen, (2006) “Labelling of cultured macrophages with novel magnetic nanoparticles” J. Magn. Magn. Mater., 304, c4-c6.(SCI).
10
J.S. Fang, T.P. Hsu, and G.S. Chen, (2006) “Crystallization and failure behavior of Ta-TM (TM = Fe, Co) nanostructured/amorphous diffusion barriers for copper metallization” J. Elec. Mater., 35 (1) 15-21.(SCI).
11
W.K. Wang, D.S. Wuu, W.C. Shih, J.S. Fang, C.E. Lee, W.Y. Lin, P. Han, R.H. Horng, T.C. Hsu, T.C. Huo, M.J. Jou, A. Lin and Y.H. Yu (2005) “Near-Ultraviolet InGaN/GaN Light-Emitting Diodes Growm on Patterned Sapphire Substrates” J. J. Appl. Phys., 44(4) 2512-2515.(SCI).
12
D.S. Wuu, W.K. Wang, W.C. Shih, R.H. Horng, C.E. Lee, W.Y. Lin, and J.S. Fang (2005)”Ehanced output power of near-ultraviolet InGaN-GaN LEDs frown on patterned sapphire substrates”, IEEE Photon. Technol. Lett., 17(2) 288-290.(SCI).
13
J.S. Fang, T.P. HSU and G.S. CHEN (2004), “Crystallization and failure behaviors of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization” Journal of Electronic materials, 33(10) 1176-1181.(SCI).
14
H.L.Chang, J.S. Fang and C.T. Kuo(2003), “Structures and properties of the crystalline Si-C-N using additional Si-source and Co-catalyst” Review on Advanced Materials Science vol 5, 432-439(SCI).
15
H.L.Chang, J.S. Fang and C.T. Kuo (2003), “Growth model of carbon nanotubes assisted with Co-based catalyst” Review on Advanced Materials Science, vol 5, 425-431(SCIE).
16
J.S Fang, H.L. Chang, G.S. Chen, and P.Y. Lee (2003), “Crystallization and failure behaviors of Ta-Co nanostructured/amorphous diffusion barriers for copper metallization” Review on Advanced Materials Science, vol 5, 510-513.(SCIE).
17
J. S. Fang, F.W. Tsai, and T.S. Chin, (2003), “Enhancement of [00l] Texture and Magnetoresistance of Sputtered La-Ca-Mn-O Thin Films on Silicon by Inserting Buffer Layers” Jpn. J. Appl. Phys., 421237-1241 (SCI).
18
G.S. Chen, J.J. Gua, C.K. Lin, C.S. Hsu, L.C. Yang, and J.S. Fang, (2002), “Evaluation of radio-frequency sputter-deposited textured TiN thin films as diffusion barriers between copper and silicon” J.Vac. Surf. Tech., A 20(2) 479-485 (SCI).
19
J. S. Fang, F.W. Tsai, and T.S. chin, (2002), “Highly Textured LaCaMnO Thin Films Grown on SiO/Si(100)”, Jpn. J. Appl. Phys., vol. 41, 600-605 (SCI).
20
J.S. Fang, C.T. Chang, and T.S. Chin, (2001), “Electric properties of barium-strontium titanate thin films deposited by two-step radio-frequency sputtering”, J. Mater. Res., Vol. 16, No. 9p.2680-2686. (SCI).
21
J.S. Fang, M.R. Jian, T.S. Chin, H.W. Zhang, B.G. Shen, (2000) “Magnetic Viscosity of NdFe11TiNx Thin Films”, Jpn. J. Appl. Phys., vol. 39, p.496. (SCI).
22
J.C. Shih, T.S. Chin, C.A Chen, and J.S. Fang, (1999), “ The Effect of Beryllium Addition on Magnetostriction of the Tb0.3Dy0.7Fe2 Alloy”, J Mag. and Mag. Mater., vol.191, p.101-106. (SCI).
23
J.S. Fang, T.S. Chin, J.C. Shih, C.A. Chen and S.W. Yung, (1999), " The ac-initial susceptibility as a measure of exchange coupling in two-phase nano-structured NdFeCuNbB magnet alloys, J Mag. and Mag. Mater., vol.195, p.588-594. (SCI).
24
J.S. Fang and T.S. Chin, (1999 ), " High Temperature cac Behaviors of Fe-Nd-B Nanocomposite Alloy, J. Journal of Material Science, (SCI).
25
J.S. Fang, M.S. Leu and T.S. Chin, (1998), “AC susceptibility of a two-phase nanocomposite Fe88Nd6B6 alloy at 77-990 K”, J. Appl. Phys. Vol.83, p.3731. (SCI).
26
J. S. Fang, M.F. Hsieh, S.K. Chen and T.S. Chin, (1997), “Magnetic properties and structure of Nd-(Fe,B) nanocomposite alloys with fixed Fe/B ratio at 4~14”, J. J. Appl. Phys. vol.36, p.6324. (SCI).
27
T.S. Chin, F.M. Chen and J.S. Fang, (1997), “Magnetostrictive properties of Tb0.3Dy0.7(Fe1-xVx)2 alloys”, IEEE Trans. on Magn., vol.33, p.3946. (SCI).
28
J.S. Fang, and T.S. Chin, (1996), “ Rapid thermal annealing of two phases nanocrystalline magnet alloys”, Materials Trans., JIM., vol.37, p.883. (SCI).
29
J.S. Fang, S.K. Chen and T.S. Chin, (1996), “ Nanocrystalline Nd6Fe88-xMxB6 (M= Ti or V) Magnets by rapid thermal annealing”, IEEE Trans. on Magn., vol.32, p.4401. (SCI).
30
F.M. Chen, J.S. Fang and T.S. Chin, (1996), ” The effect of carbon on magnetostrictive properties of the Tb0.3Dy0.7Fe2 alloy”, IEEE Trans. on Magn., vol.32, p.4776. (SCI).
31
J.M. Yao, T.S. Chin, J.S. Fang and S.K. Chen, (1995), “ Magnetic aftereffect and magnetization process of nanocrystalline alpha-Fe/Nd2Fe14B two-phases magnet alloy”, IEEE Trans. on Magn., vol.31, p.3611. (SCI).
研討會論文
國外conference
1
Jia-Huei Lin , Chen-Sheng Hsu and Jau-Shiung Fang(2009) “ 15 nm Ru Diffusion Barrier on NiSi/Si for Sub-45-nm Cu Contact plug ”, TMS in San Francisco (USA).
2
Wei-Hsiang Luo, Jen-Chieh Yang, Wei-Ming Hsieh, Chia-His Hsu, Ting-Kan Tsai and Jau-Shiung Fang(2009) “Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition”, TMS in San Francisco (USA).
J.S. Fang, Y.S. Lin, C.S. Cheng, Y.C. Lee and H.Y. Hsio (2007) “Enhancement of conductivity and transmittance of Al-doped ZnO thin films prepared by a metallic Zn:Al target” EUROMAT2007 inNuremberg, (Germany).
5
J.S. Fang and H.C. Chen, (2007) “Preparation of the High-Quality Indium Zinc Oxide by Reactive Magnetron Co-sputtering Technique from Indium and Zinc Metallic Targets” TMS in Orlando (USA).
6
J.S. Fang and W.K. Cheng, (2006) “Evaluation of magnetoresistance characteristic of Co-Ti-O granular alloy thin films” 兩岸顆粒會議, Beijing (China).
7
J.S. Fang, T.P. Hsu and L.C. Yang, (2005) “Diffusion Barrier Properties of DC Sputtering Deposited Ta-Ni Films in Cu/SiO2/Si Contact Schemes”, EUROMAT2005 inPrague (CZ).
8
J.S. Fang, M.L. Ker, and T.P. Hsu, (2005) “Thermal stability enhancement of sputtered Ta-Co-N diffusion barrier layer for copper metallization”, EUROMAT2005 in Prague (CZ).
9
Jau-Shiung Fang and Chen-Siang Hsu, (2005) “Designing experimental determination of sheet resistance of a submicron titanium self-aligned silicide formation”, TMS 2005 in San Francisco (USA).
10
方昭訓, 李安倫, 戴明鳳, (2004) “低溫燃燒合成製備NixZn1-xFe2O4(0.3≤ x ≤0.8) 鐵氧體粉末與特”, The Chinese journal of Process Engineering, vol. 4, 212-217.
11
李安倫, 方昭訓, 戴明鳳, (2004) “燃燒法合成鐵鎳合金奈米粉末及包覆金的製程與特性”, The Chinese journal of Process Engineering, vol. 4, 218-223.
12
J.S. Fang, F.W. Tsai, and T.S. Chin, (2002) “ Highly [00l] Texture and CMR of Sputtered La-Ca-Mn-O Thin Films on Silicon with Buffer Layers”, International Magnetism and Magnetic Materials Conference. Amsterdam (The Netherlands)
13
M.S. Leu, J.S. Fang and T.S. Chin, (2001), “In-Situ Permeability Study of Nano-Crystalline Magnetic Alloys”, Chinese Physics Conference.
14
J.M. Yao, J.S. Fang and T.S. Chin, (1996), “magnetization Reversal of Ti-modified Nd2Fe14B/a-Fe nanocomposite magnets”, International Conference on Rare Earth Permanent Magnets. p.409.
15
J.S. Fang, T.S. Chin and S.K. Chen, (1996), “Magnetic properties of nanocomposite Fe88-xMxNd6B6 magnets (M= Zr or Nb) by rapid thermal annealing” International Conference on Rare Earth Permanent Magnetsp.698.
L. -C. Yang, C. Y. Cheng, J. S. Fang, W. Z. Chang , G. S. Chen (2006)” Characterization of polycrystalline CuInSe2 thin films deposited by sputtering and evaporation as a function of composition” Annual Conference of Taiwan Vacuum Society.
49
方昭訓,賴思宇 (2006) “鈷/氧化鈦顆粒合金多層薄膜的磁阻特性研究” Annual Conference of Taiwan Vacuum Society.
50
J.S. Fang, H. C. Chen (2006)” 氧化銦鋅(IZO)非晶質薄膜擴散阻礙特性與銅製程整合” Annual Conference of Taiwan Vacuum Society.
51
林雍舜, 鄭仲祥, 李逸群, 蕭欣儀, 陳慧津, 李景恆,方昭訓 (2006)”以Zn:Al金屬靶濺鍍沉積製備Al:ZnO薄膜之透明導電膜性質” Annual Conference of the Chinese Society for Material Science.
52
方昭訓, 陳慧津, 黃智祥, 楊立中, 李景恆 (2006)”金屬靶製備氧化銦鋅薄膜性質之影響” Annual Conference of the Chinese Society for Material Science.
53
方昭訓, 柯銘禮, 陳慧津(2006)” 利用Ta-Co-N作為銅製程擴散阻礙層之研究” Annual Conference of the Chinese Society for Material Science.
54
林家輝, 陳枝政, 黃文良, 戴穎蓁, 陳慧津, 方昭訓,李景恆 (2006)”鎳矽化物銅製程阻障層之特性探討” Annual Conference of the Chinese Society for Material Science.
55
紀宗佑, 廖敬期, 陳慧津, 李景恆, 方昭訓 (2006)”離子束濺鍍與磁控濺鍍製備Ta擴散阻礙層與銅製程之特性” Annual Conference of the Chinese Society for Material Scienc.
56
李岳修, 方昭訓, 楊立中(2006)”射頻交流磁控濺鍍ZnO:Al透明導電薄膜之材料特性與研究” Annual Conference of the Chinese Society for Material Science.
57
方昭訓, 賴思宇, 陳佑慈, 李景恆(2006)”不連續Co/TiO2顆粒合金多層薄膜的磁阻特性” Annual Conference of the Chinese Society for Material Science.
58
李彥佑, 陳苡諺,賴思宇,李景恆,方昭訓(2006)”氧化銦絕緣層之製備與穿隧磁阻特性: Annual Conference of the Chinese Society for Material Science.
59
J.S. Fang, M.L. Ker, and T.P. Hsu (2005),” Phase formation and microstructure of amorphous Ta-Co-N thin films on Si substrates”, Annual Conference of the Chinese Society for Material Science.
60
J.S. Fang, H.Y. Hsieh (2005),” Structural and passivative behaviors of Cu(In) thin film”Annual Conference of the Chinese Society for Material Science.
61
JS. Fang, T.P. Hsu, C.H. Hsu and G.S. Chen, (2004) ” Crystallization and failure behaviors of Ta-Ni nanostructured/amorphous diffusion barriers for copper metallization” Annual Conference of the Chinese Society for Material Science.
62
C.M. Zheng, S.H. Zend, J.Y. Zhang, J.L. Zhang, J.W. Lin, Y.R. Li, T.P. Hsu, C.S. Hsu and J.S. Fang, (2004) “Diffusion barrier characteristics of amorphous Ta50Fe50 thin film prepared by a DC sputtering method”, Annual Conference of the Chinese Society for Material Science.
63
T.H. Hsu, S.C. Zhang, P.J. Chen, B.Y. Chen, T.P. Hsu, C.S. Hsu and J.S. Fang, (2004) “ Diffusion barrier properties of amorphous Ta-Co thin film for copper metalization”, Annual Conference of the Chinese Society for Material Science.
64
方昭訓, 曾王坡, 許藻錶, (2003) “Crystallization and failure behaviors of Ta-Co nanostructured/amorphous diffusion barriers for copper metallization” 材料年會論文集。
65
方昭訓 “Evaluation of Sheet Resistance for 0.30mm Titanium Self-Aligned Silicide Process by Design of Experimental Method” 材料年會論文集 (2002).
