Wei-Long Liu - Department Materials Science and Engineering

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Wei-Long Liu

publish date : 2010-06-26

教師基本資料
	姓名	劉偉隆
	英文名	Wei-Long Liu
	性別	男
	現(兼)職稱	教授
	聯絡電話	(05) 631-5470
	E-mail	wlliu@sunws.nfu.edu.tw

經歷 & 專長
主要學歷	國立中央大學物理系學士國立清華大學材料所碩士
專長與研究領域	固態薄膜/奈米材料/粉末冶金/材料電化性質/材料物理性質/光電材料/磁性材料
相關經歷	國立虎尾科技大學材料科學與工程系副教授2006.08-至今國立虎尾技術學院材料科學與工程系講師1986.07-2006.07 私立化學股份有限公司生產部廠長1980.07-1985.05

曾執行之計畫（國科會及各種產學計畫）
補助或委託機構	起迄年月	計畫名稱(計畫編號)
國科會	97/8/1~98/7/31	奈米氧化鋅場效電晶體之氣體感測器(II)(97-2221-E-150-003-)
國科會	96/8/1~97/7/31	奈米氧化鋅場效電晶體之氣體感測器(96-2221-E-150-031-)
國科會	94/8/1~95/7/31	鋁背板耐用性提升之研究(94-2622-E-020-009-CC3)
國科會	82/8/1~83/7/31	脈波電流對複合鍍膜性質之影響(NSC83-0117-C150-025-E)。
國科會	81/8/1~82/7/31	脈波電流對鎳膜性質之影響(NSC82-115-C-150-518-E)。

研究成果目錄
期刊論文
1	W. L. Liu, S. H. Hsieh, T. K. Tsai, and W.J. Chen, “Growth Kinetics of Electroless Cobalt Deposition by TEM,”J. Electrochem. Soc. 151 C680-C683, (2004). (SCI, IF=2.190, Rank=2/19, MATERIALS SCIENCE, COATINGS & FILMS )
2	C. M. Liu, W. L. Liu, W. J. Chen, S. H. Hsieh, T. K. Tsai, and L. C. Yang, “ITO as a Diffusion Barrier Between Si and Cu,”J. Electrochem. Soc. 152 G234-G239 (2005). (SCI,IF=2.190, Rank=2/19, MATERIALS SCIENCE, COATINGS & FILMS )*
3	C.M. Liu, W.L. Liu, S.H. Hsieh, T.K. Tsai, W.J. Chen, “Interfacial reactions of electroless nickel thin films on silicon,”Applied Surface Science 243 259–264 (2005). (SCI, IF=1.263,Rank=7/19, MATERIALS SCIENCE, COATINGS & FILMS )*
4	W. L. Liu, S. H. Hsieh, T. K. Tsai, W. J. Chen, S. S. Wu, “Temperature and pH dependence of the electroless Ni-P deposition on silicon,” Thin Solid Films 510 102 –106 (2006). (SCI, IF=1.569, Rank=4/19, MATERIALS SCIENCE, COATINGS & FILMS )
5	W.L. Liu, W. J. Chen, T.K. Tsai, H.H. Tsai, and S.H. Hsieh, “Interface structure between epitaxial NiSi2 and Si ,”Journal of University of Science and Technology Beijing, 13 558-563 (2006). (SCI, IF=0.342, Rank=9/16, MINING & MINERAL PROCESSING; Rank= 35/67 METALLURGY & METALLURGICAL ENGINEERING)*
6	W. L. Liu, W. J. Chen, T. K. Tsai, S. H. Hsieh, C.M. Liu, “Effect of Tin-doped Indium Oxide Film Thickness on the Diffusion Barrier between Silicon and Copper,” Thin Solid Films, 515 2387–2392 (2006) (NSC 94-2216-E-020-001). (SCI, IF=1.569, Rank=4/19, MATERIALS SCIENCE, COATINGS & FILMS )*
7	W.L. Liu, W. J. Chen, T.K. Tsai, S.H. Hsieh and S.Y. Chang, “Effect of nickel on the initial growth behavior of electroless Ni–Co–P alloy on silicon substrate,”Applied Surface Science 253 (2007) 3843–3848 (NSC 94-2216-E-020-001). (SCI, IF=1.406, Rank=6/18, MATERIALS SCIENCE, COATINGS & FILMS )*
8	S.S. Wu, W.L. Liu, T.K. Tsai, S.H. Hsieh, and W.J. Chen, “Growth behavior of electroless copper on silicon substrate,”Journal of University of Science and Technology Beijing 14 (2007) 67-71 (SCI, IF=0.342, Rank=9/16, MINING & MINERAL PROCESSING; Rank=35/67 METALLURGY & METALLURGICAL ENGINEERING).
9	W.L. Liu, S.H. Hsieh, S.J. Hwang, T.K. Tsai, W. J. Chen ,”Tribological properties of electroless Ni-P-SiC composite coatings in rolling/sliding contact under boundary lubrication,”Journal of University of Science and Technology Beijing 14 (2007) 167-172 (SCI, IF=0.342,Rank=9/16, MINING & MINERAL PROCESSING; Rank= 35/67 METALLURGY & METALLURGICAL ENGINEERING).
10	W. L. Liu, W. J. Chen, T. K. Tsai, S. H. Hsieh, C.M. Liu, “Effect of Tin-doped Indium Oxide Film as Capping Layer on the Agglomeration of Copper Film and the Appearance of Copper Silicide,”Applied Surface Science 253 (2007) 5516-5520 (NSC 94-2216-E-020-001). (SCI, IF=1.406, Rank=6/18, MATERIALS SCIENCE, COATINGS & FILMS )*
11	W. L. Liu, S. H. Hsieh, T. K. Tsai, and W. J. Chen, “Deposition of electroless Ni on micro-sized acrylic spheres,” Journal of Materials Science 42 (2007) 2121–2125 (SCI, IF=0.901, Rank=84/178, MATERIALS SCIENCE, MULTIDISCIPLINARY)
12	W. J. Chen, W. L. Liu, S. H. Hsieh, “Preparation of nanosized ZnO using brass,”Applied Surface Science 253(2007) 6749-6753. (SCI, IF=1.406, Rank=6/18, MATERIALS SCIENCE, COATINGS & FILMS )*
13	W. L. Liu, S. H. Hsieh, and W. J. Chen, “Preparation of Sn films deposited on carbon nanotubes,”Applied Surface Science 253 (2007) 8356-8359. (SCI, IF=1.406, Rank=6/18, MATERIALS SCIENCE, COATINGS & FILMS )*
14	W. L. Liu, S. H. Hsieh, and W. J. Chen, C. F. Lu, “Growth of nanosized Zinc Oxide on Ni/Cu-Zn/SiO2/Si substrate,”Surface and Coatings Technology 201 (2007) 9221-9225 (SCI, IF=1.678, Rank=4/18, MATERIALS SCIENCE, COATINGS & FILMS*)
15	W. L. Liu, S. H. Hsieh, and W. J. Chen, J. H. Lee, “Study of nanosized Zinc Oxide on Cu-Zn alloy substrate using Taguchi method,”Surface and Coatings Technology 201 (2007) 9238-9242. (SCI, IF=1.678, Rank=4/18, MATERIALS SCIENCE, COATINGS & FILMS*)
16	T.K. Tsai, S.S. Wu, W.L. Liu, S.H. Hsieh, and W. J. Chen, “Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon,”J. Electron. Mater., 36, (2007), 1408-1414. (SCI) (SCI, IF=1.320, Rank=57/227, ENGINEERING, ELECTRICAL & ELECTRONIC)
17	C. C. Chuang, W. L. Liu, W. J. Chen, J. H. Huang “The role of Ti interlayer in carbon nanotube growth”Surface and Coatings Technology, 202 (2008), 2121–2125 (SCI, IF=1.678, Rank=4/18, MATERIALS SCIENCE, COATINGS & FILMS*).
18	W. L. Liu, S. H. Hsieh, and W. J. Chen, “Growth behavior of Ni-P film on Fe/Si substrate in an acid electroless plating bath, ”Journal of the Electrochemical Society, 155 (2008), D192-D195, (SCI, IF=2.483, Rank=1/18, MATERIALS SCIENCE, COATINGS & FILMS )*
19	C. C. Chuang, W. L. Liu, W. J. Chen, J. H. Huang “Temperature and substrate dependence of structure and growth mechanism of carbon nanofiber”Applied Surface Science 254 (2008) 4681-4687. (SCI, IF=1.406, Rank=6/18, MATERIALS SCIENCE, COATINGS & FILMS )*
20	W.L. Liu, S.H. Hsieh, W.J. Chen, Y.C. Hsu, “Growth behavior of electroless Ni-Co-P deposits on Fe”Applied Surface Science 255 (2009) 3880-3883. (SCI, IF=1.406, Rank=6/18, MATERIALS SCIENCE, COATINGS & FILMS )*
21	Chia-Chih Chung, Wei-long Liu, Wen-Jauh Chen, and Jin-Hua Huang, “Growth of graphite film over the tips of vertical carbon nanotubes using Ni/Ti/Si substrate,” International Journal of Minerals, Metallurgy and Materials, Vol. 16, February 2009. (SCI, IF=0.325, Rank=9/15, MINING & MINERAL PROCESSING; Rank=38/65 METALLURGY & METALLURGICAL ENGINEERING).
22	Wei-Long Liu, Shu-Huei Hsieh, Wen-Jauh Chen, Pei-IWei, and Jiing-Herng Lee, “ Synthesis of the CuInSe2 thin film for solar cells using the electrodeposition”,International Journal of Minerals, Metallurgy and Materials ,Vol. 16, February 2009. (SCI, IF=0.325, Rank=9/15, MINING & MINERAL PROCESSING; Rank=38/65 METALLURGY & METALLURGICAL ENGINEERING)*.
23	Wen Jauh Chen, W. L. Liu, S. H. Hsieh, Wan Ling Chen, “Structures and magnetic properties of electroless Ni multilayers on Fe/Si substrate” , Thin Solid Films, (SCI, IF=1.569, Rank=4/19, MATERIALS SCIENCE, COATINGS & FILMS )*
研討會論文
1	W.L. Liu , S.H. Hsieh, T. K. Tsai, and W.J. Chen, “A Method for Mass Production of Carbon Nanofibers by Thermal Chemical Vapor Deposition,”The 3rd Asian Conference on Chemical Vapor Deposition, Taipei, Taiwan, November 2004
2	T. K. Tsai, W. L .Liu, S. H. Hsieh, W. J. Chen, and H. S. Wu, “The growth morphology and mechanism of electroless NiP deposition on silicon”, 材料年會，11 月17～18 日，工研院，新竹，2004。
3	劉偉隆，陳文照，張淑怡，蔡定侃，謝淑惠，’鎳對無電鍍鈷薄膜成長之影響’，中國材料年會，11 月25-26 日，淡江大學，2005。
4	陳文照、江松懋、劉偉隆、蔡定侃、謝淑惠，’奈米探管於燃料電池應用之研究’，中國機械工程學會第二十二屆全國學術研討會論文集，11 月25-26 日，中央大學，2005。
5	W. L. Liu, W. J. Chen*, S. H. Hsieh, T. K. Tsai, and C. M. Liu, “Effect of Tin-doped Indium oxide film thickness on the Diffusion Barrier between Silicon and Copper” 209th Meeting of The Electrochemical Society, Denver, Colorado, U.S.A., May, 2006.
6	W. L. Liu, W. J. Chen*, S. H. Hsieh, and T. K. Tsai, “A Capillary Electrophoresis Chip for Rhodamine B and Inorganic Ion detection Utilizing Contactless Capacitance Detection” Nanotech 2006, Boston, Massachusetts, U.S.A., May.
7	S.S.Wu、W.L.Liu、T.K.Tasi、S.H.Hsieh、W.J.Chen*，’Growth behavior of electroless copper deposition on silicon substrate’北京科大屏科大學術研討會，7 月2-4 日，北京科大，2006。
8	W.L. Liu 、S.H. Hsieh 、S.J. Hwang、T.K. Tasi 、W.J.Chen* ，‘Tribiological properties of electroless Ni-P-SiC composite coatings in rolling/sliding contact under boundary lubrication’ 北京科大屏科大學術研討會，7 月2-4 日，北京科大，2006。
9	蔡艾如、劉偉隆、陳文照，’Growth kinetics of electroless Ni-Cu-P deposited on Si substrate in basic plating bath’ 北京科大屏科大學術研討會，7 月2-4 日，北京科大，2006。
10	吳信賢、蔡定侃、劉偉隆、謝淑惠、陳文照，’以無電鍍方法製備鈷合金薄膜作為擴散阻礙層之研究’中國材料科學年會，11 月24-25 日，成功大學，2006。
11	吳信賢、蔡定侃、劉偉隆、謝淑惠、陳文照，”The intial deposition behavior of electroless copper deposition on silicon”中國材料科學年會，11 月24-25 日，成功大學，2006。
12	陳文照、劉偉隆、謝淑惠、蔡定侃，’Preparation of nanosized ZnO using α Brass’，中國材料科學年會，11 月24-25 日，成功大學，2006。
13	陳文照、邱肇斌、劉偉隆，’銅製程中錫銦氧化物(ITO)薄膜擴散阻礙層特性之研究’，中國材料科學年會，11 月24-25 日，成功大學，2006。
14	W. L. Liu, W. J. Chen*, S. H. Hsieh, T. K. Tsai, and Y. C. Hsu, “Growth Behavior of Electroless Ni-Co-P Deposits on Silicon” 211th Meeting of The Electrochemical Society, Chicago, Illinois, U.S.A., May, 2007.
15	W. L. Liu, W. J. Chen*, S. H. Hsieh, T. K. Tsai, and C. M. Liu, “Growth of NiSi Nanowires by Electroless Nickel Plating on Silicon Nanowires” 211th Meeting of The Electrochemical Society, Chicago, Illinois, U.S.A., May, 2007.
16	C. C. Chuang, W. L. Liu, W. J. Chen*, and J. H. Huang, “ Effect of Thickness of Ni Layer in Ni/TiO2/Ti/Si Substrate on the Growth behavior of Carbon Nanotubes” 211th Meeting of The Electrochemical Society, Chicago, Illinois, U.S.A., May, 2007.
17	C. C. Chuang, W. L. Liu, W. J. Chen*, and J. H. Huang, “Effect of Thickness Ration of Ni Layer to Ti Layer in Ni/Ti/Si Substrate on the Growth Behavior of Carbon Nanotubes” 211^th Meeting of The Electrochemical Society, Chicago, Illinois, U.S.A., May, 2007.
18	S. H. Hsieh, W. L. Liu, W. J. Chen, J. H. Lee, “Study of nanosized Zinc Oxide grown on Co/Cu-Zn alloy substrate using Taguchi method”, 4th International Conference on Materials forAdvanced Technologies, 1-6 July 2007, Singapore.
19	W. L. Liu, J.J. Horng, S. H. Hsieh*, W. J. Chen, K. H. Huang, “The effect of CNTs on the growth and particle sizes of TiO2 on nano-composite TiO2/CNTs ”, 4th International Conference on Materials for Advanced Technologies, 1-6 July 2007, Singapore.
20	魏珮伊，劉偉隆，謝淑惠* ，陳文照，許禎祥，"利用田口法和電化學沉積技術製備 CuInSe2 太陽能電池薄膜"，2007『屏東科技大學』暨『北京科技大學』第二屆學術交流研討會，屏東科技大學, 2007 年12 月24 日。
21	W. T. Chien, M. H. Jiang, W. L. Liu, and W. J. Chen*, “Study on laser annealing of electroless Ni-P thin film by Taguchi method”, The 4th International Conference on Technological Advances of Thin Films & Surface Coatings, 13-16 July 2008, Singapore.
22	Wen Jauh Chen, Wei Long Liu*, Shu Huei Hsieh, Wan Ling Chen, “Structures and magnetic properties of electroless Ni multilayers on Fe/Si substrate”, The 4th International Conference on Technological Advances of Thin Films & Surface Coatings, 13-16 July 2008,Singapore.
23	李美津、謝淑惠、洪肇嘉、陳文照、劉偉隆，「複合奈米材料Fe-Ni/CNT 之製備」，第五屆環境保護與奈米科技學術研討會，桃園中央大學，2008 年9 月25 日
24	蔡明政、謝淑惠、劉偉隆、洪肇嘉、陳文照，「複合奈米材料Fe-Ni/Al2O3 之製備」，第五屆環境保護與奈米科技學術研討會，桃園中央大學，2008 年9 月25 日
25	簡竹模, 謝淑惠, 劉偉隆, 陳文照，" ITO 擴散阻障層直接電鍍銅之研究"，中國材料科學年會，11 月21-22 日，國立台北科技大學，2008。
26	謝淑惠, 簡竹模, 劉偉隆, 陳文照，"超薄Ru/ITO 擴散阻障層特性之研究"，中國材料科學年會，11 月21-22 日，國立台北科技大學，2008。
27	劉偉隆, 簡竹模, 謝淑惠, 陳文照，"無電鍍銅與濺鍍銅對ITO 擴散阻障層特性之影響"，中國材料科學年會，11 月21-22 日，國立台北科技大學，2008

專利、專書或專書論文
1	"Powder containing Fe-Ni nano-particles and its manufacturing method, " US 7,247,376 B1,，發明人：陳文照，劉偉隆，謝淑惠，蔡定侃，洪肇嘉2004/06/17~2024/06/17。
2	"含有鐵-鎳奈米粒子之粉體及其製造方法, " 中華民國發明I-093114558 號，發明人：，陳文照，蔡定侃，謝淑惠，洪肇嘉，劉偉隆，2008/09/11~2027/6/1。

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參加國際學術研討會
1	The 4th International Conference on Technological Advances of Thin Films & Surface Coatings, 13-16 July 2008,Singapore.
2	211^th Meeting of The Electrochemical Society, Chicago, Illinois, U.S.A., May, 2007.
3	北京科大屏科大學術研討會，7 月2-4 日，北京科大，2006。

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