教  師  基  本  資  料

姓名

蔡定侃

英文名

Ting-Kan Tsai

性別

男

現(兼)職稱

副教授

聯絡電話

(05) 631-5469

E-mail

dktsai@sunws.nfu.edu.tw

經 歷  &  專 長

主要學歷

逢甲大學材料系

成功大學材料所碩士班

交通大學材料所博士班

專長與研究領域

無電鍍製程/電子顯微鏡/奈米碳管/能源材料

相關經歷

國立雲林工專助教

國立虎尾科技大學講師

曾執行之計畫（國科會及各種產學計畫）

補助或委託機構

起迄年月

計畫名稱(計畫編號)

國科會

97/8/1~98/7/31

Ni含量對 Pd-Ni合金之氫氣選透性能的影響（NSC 97-2815-C-150-020-E）

國科會

97/8/1~98/7/31

利用無電鍍複合鍍製作多層金屬-電介質太陽能選擇性吸收膜之研究(NSC 97-2221-E-150-050)

國科會

96/8/1~97/7/31

無電鍍CoWP析鍍於矽基材之研究（NSC 96-2815-C-150-008-E）

國科會

95/8/1~96/7/31

利用無電鍍複合鍍製作太陽能選擇性吸收膜之研究（NSC 95-2221-E-150-004）

國科會

94/8/1~95/7/31

無電鍍Pd-Ni合金膜分離純化氫氣之研究(NSC 94-2212-E-150-030)

國科會

93/8/1~94/7/31

奈米碳管吸附重金屬之研究（NSC 93-2815-C-150-014-E）

國科會

92/8/1~93/7/31

Ni-P催化合金生長奈米碳管之研究（NSC 92-2815-C-150-017-E）

國科會

92/8/1~93/7/31

無電鍍技術製造SnOx薄膜氣體感測器(NSC 92-2626-E-150-001)

研 究 成 果 目 錄

期 刊 論 文

1

T.K.Tsai*, C.C.Chuang, C.C.Chao, and W.L.Liu, “Growth and field emission of carbon nanofibers on electroless Ni-P alloy catalyst ” Diamond and Related Materials 12 (2003) 1453-1459

2

T.K.Tsai*, C.C.Chao,“The growth morphology and crystallinity of electroless NiP deposition on silicon”Applied Surface Science 233 (2004) 180-190

3

W.L.Liu, S.H.Hsieh*, T.K.Tsai, and  W.J.Chen,“ Growth kinetics of electroless cobalt deposition by TEM” Journal of The Electrochemical Society 151（2004）C680-C683

4

C.M.Liu, W.L.Liu, S.H.Hsieh, T.K.Tsai and W.J.Chen*, “Interfacial reactions of electroless nickel thin films on silicon” Applied Surface Science 243(2005) 259-264

5

C.M.Liu, W.L.Liu, W.J.Chen*, S.H.Hsieh, T.K.Tsai and L.C. Yang,“ITO as a diffusion barrier between Si and Cu” Journal of The Electrochemical Society 152(2005) G234-239.

6

W. L. Liu, S. H. Hsieh, T. K. Tsai*, W. J. Chen, S. S. Wu, “Temperature and pH dependence of the electroless Ni-P deposition on silicon” Thin Solid Film 510 (2006) 102-106

7

W. L. Liu, W. J. Chen*, T. K. Tsai, H. H. Tsai,S. H. Hsieh,”Interface structure between epitaxial NiSi2 and Si” Journal of University of Science and Technology Beijing 13 (2006) 558-563

8

W.L.Liu, W.J.Chen*, T.K.Tsai, S.H.Hsieh, and C.M.Liu, “Effct of tin-doped indium oxide film thickness on the diffusion barrier between silicon and copper”  Thin Solid Film 515 (2006) 2387-2392

9

W. L. Liu, S. H. Hsieh, T. K. Tsai, W. J. Chen “Deposition of electroless Ni on micro-sized acrylic spheres” Journal of Materials Science 42(2007) 2121-2125

10

S. S. Wu, W. L. Liu, T. K. Tsai*, S. H. Hsieh, W. J. Chen, “Growth behavior of electroless copper on silicon substrate” Journal of University of Science and Technology Beijing 14 (2007) 67-71

11

W. L. Liu, S. H. Hsieh,S. J. Hwang, T. K. Tsai, W. J. Chen, “Tribological properties of electroless Ni-P-SiC composite coatings in rolling/sliding contact under boundary lubrication” Journal of University of Science and Technology Beijing 14 (2007) 167-172

12

W.L.Liu, W.J.Chen, T.K.Tsai, S.H.Hsieh, and C.M.Liu, “Effct of tin-doped indium oxide film as capping layer on the agglomeration of copper film and the appearance of copper silicide” Applied Surface Science 253(2007) 5516-5520

13

W. J. Chen, W. L. Liu, S. H. Hsieh, T. K. Tsai, “Preparation of nanosized ZnO using αbrass” Applied Surface Science, 253(16), 15June 2007, 6749-6753.

14

W.L.Liu, W.J.Chen, T.K.Tsai, S.H.Hsieh, and S. Y. Chang, “Effct of nickel on the initial growth behavior of electroless Ni-Co-P alloy on silicon substrate” Applied Surface Science 253(2007) 3843-3848

15

T. K. Tsai *, S. S. Wu, W. L. Liu , S. H. Hsieh , W. J. Chen, “Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon” Journal of Electronic Materials, v.36, n.11(2007) p1408-1414.

16

T. K. Tsai *, S. S. Wu, C. S. Hsu, J.S. Fang,〝Effect of Phosphorus in Electroless CoWP film on the Diffusion Barrier between Electroless Copper and Silicon〞 submitted in Thin Solid Films 2008

研討會論文

1

蔡定侃, 朝春光 ” 鐵基複合材料之陶瓷強化材表面改質之研究 “ 2000年材料年會

2

T.K.Tsai, W.L.Liu, S.H.Hsieh, and Wen-Jauch Chen, “ Growth of carbon nanotubes on electroless Ni-P alloy catalyst ” 2002 MRS Fall Meeting.

3

W.L.Liu, T.K.Tsai, S.H.Hsieh, W.J.Chen, “Effect of phosphorus on the nickel silicide formation “ 2002年材料年會

4

謝淑惠, 劉偉隆, 蔡定侃, 陳文照, 江正輝, 江振貴 “The study of growth kinetics of electroless cobalt deposition by transmission electron microscope” 2002材料年會

5

T.K.Tsai, W.L.Liu, S.H.Hsieh, Wen-Jauch Chen, and H.S.Wu, “The growth morphology and mechanism of electroless NiP deposition on silicon” 2004年材料年會

6

T.K.Tsai, W.L.Liu, S.H.Hsieh,and Y.Q.Yao, “The study of the SnO2 thin film for gas senser using the electroless plating technology” 2004年材料年會

7

W.L. Liu , S.H. Hsieh, T. K. Tsai, and W.J. Chen, “A Method for Mass Production of Carbon Nanofibers by Thermal Chemical Vapor Deposition,” The 3rd Asian Conference on Chemical Vapor Deposition, Taipei, Taiwan, November 2004

8

劉偉隆，陳文照，張淑怡，蔡定侃，謝淑惠，’鎳對無電鍍鈷薄膜成長之影響’， 中國材料年會，11月25-26日，淡江大學，2005

9

陳文照、江松懋、劉偉隆、蔡定侃、謝淑惠，’奈米碳管於燃料電池應用之研究’，中國機械工程學會第二十二屆全國學術研討會論文集，11月25-26日，中央大學，2005

10

W. L. Liu, W. J. Chen, S. H. Hsieh, T. K. Tsai, and C. M. Liu, “Effect of Tin-doped Indium oxide film thickness on the Diffusion Barrier between Silicon and Copper” 209th Meeting of The Electrochemical Society, Denver, Colorado, U.S.A., May, 2006

11

W. L. Liu, W. J. Chen, S. H. Hsieh, and T. K. Tsai, “A Capillary Electrophoresis Chip for Rhodamine B and Inorganic Ion detection Utilizing Contactless Capacitance Detection” Nanotech 2006, Boston, Massachusetts, U.S.A., May.

12

吳信賢，蔡定侃，劉偉隆，謝淑惠，陳文照，”以無電鍍方式製備鈷合金薄膜作為擴散阻障層之研究” 中國材料年會，11月25-26日，成功大學，2006

13

吳信賢，蔡定侃，劉偉隆，謝淑惠，陳文照，”The intial deposition behavior of electroless copper deposition on silicon” 中國材料年會，11月25-26日，成功大學，2006

14

T. K. Tsai *, S. S. Wu , W. L. Liu , S. H. Hsieh , W. J. Chen ”Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon” TMS 2007, Orlando, Florida, U.S.A. 25/2-1/3 March.

15

W. L. Liu, S. H. Hsieh, T. K. Tsai, W. J. Chen, “The effect of CNTs on the growth and particle sizes of TiO₂ on nano-composite TiO₂/CNTs ”, 4^th International Conference on Materials for Advanced Technologies, 1-6 July 2007, Singapore.

16

蔡定侃，吳信賢，劉偉隆，謝淑惠，陳文照，”The effect of the electroless CoWP film thickness on diffusion barrier properties” 中國材料年會，11月16-17日，交通大學，2007

17

許哲源，蔡定侃，劉偉隆，謝淑惠，陳文照，”無電鍍複合鍍製備太陽能選擇性吸收膜之性質探討” 中國材料年會，11月16-17日，交通大學，2007

18

蔡定侃，李景恆，許哲源，江安洲，〝Al₂O₃對Ni-Al₂O₃太陽能選擇性複合吸收膜之性質影響〞2008中國顆粒學會年會暨海峽兩岸顆粒技術研討會，上海

19

T. K. Tsai, H.C. Chen, J. H. Lee, J. S. Fang,”High conductivity Indium Zinc Oxide prepared by Reavtive Magnetron Co-sputtering Technique from Indium and Zinc Metallic Target” THIN FILMS 2008,13-16, july, 2008, Singapore

20

許哲源，蔡定侃〝無電鍍複合鍍製備Ni-Al₂O₃太陽能選擇性複合吸收膜之性質探討〞2008 材料年會，台北

21

江安洲，林俊仁，許哲源，蔡定侃〝無電鍍複合鍍製備太陽能選擇性黑鎳吸收膜〞2008 材料年會，台北

22

T. K. Tsai *, J. H. Lee, S. S. Wu, J.S. Fang, "Failure behavior of electroless CoWP film as a diffusion barrier between electroless Cu and Si"  2009 TMS Annual Meeting & Exhibition, February 15-19, 2009 , San Francisco, California, USA

23

W. H. Luo, T. K. Tsai, J. S. Fang, " Ehancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition"  2009 TMS Annua l Meeting & Exhibition, February 15-19, 2009 , San Francisco, California, USA

專利、專書或專書論文

1

"含有FE-NI奈米粒子之粉體及其製造方法"專利號碼: US 7, 247,376 B1專利期間: 2004.06.17~2024.06.17

技術報告及其他

略

其他參與活動

略

參加國際學術研討會

1

MRS Fall Meeting 2002

2

The 3rd Asian Conference on Chemical Vapor Deposition, Taipei, Taiwan, November 2004

3

209th Meeting of The Electrochemical Society, Denver, Colorado, U.S.A., May, 2006

4

Nanotech 2006, Boston, Massachusetts, U.S.A., May.2006

5

TMS 2007, Orlando, Florida, U.S.A. 25/2-1/3 March.

6

4th International Conference on Materials for Advanced Technologies, 1-6 July 2007, Singapore.

7

THIN FILMS 2008,13-16, july, 2008, Singapore

8

2009 TMS Annual Meeting & Exhibition, February 15-19, 2009 , San Francisco, California, USA

參與之學術團體 

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個人其他補充資料

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